Building Code Glossary
Hazardous Production Material (HPM): Building Code Definition
How the IBC 2009, IFC 2009 define hazardous production material (hpm), where the wording differs, and which chapters depend on the term.
On this page
Last updated September 7, 2026 · Definitions quoted from the 2009 International Codes as transcribed in this site's building-codes collection, with the source chapter linked for each quotation. Usage counts are computed over the chapters hosted here, one copy per code. The [ICC code library](https://codes.iccsafe.org/codes) publishes the current model text and the [ICC adoption maps](https://www.iccsafe.org/advocacy/code-adoption-maps/) show which edition a jurisdiction has adopted; those sources control.
Direct answer
Hazardous production material (hpm) is a defined term in the International Building Code (IBC) 2009, in Special Detailed Requirements Based on Use and Occupancy. The code's own words are: “A solid, liquid or gas associated with semiconductor manufacturing that has a degree-of-hazard rating in health, flammability or instability of Class 3 or 4 as ranked by NFPA 704 and which is used directly in research, laboratory or production processes which have as their end product materials that are not hazardous.” The IFC 2009 defines the same term with different wording, so the controlling text depends on which code governs the question in front of you — the comparison below sets the versions side by side. The term is used in 4 chapters of this corpus, most often in Semiconductor Fabrication Facilities (IFC 2009), Definitions (IBC 2009), Special Detailed Requirements Based on Use and Occupancy (IBC 2009). These pages transcribe the 2009 model text; verify the definition against the edition and amendments your authority having jurisdiction has adopted.
Content and cited inputs reviewed by Scott Barrington, Harth founder and architectural technology specialist · Published 2026-09-07 · Updated 2026-09-07.
What does this term mean?
Hazardous Production Material (HPM) — IBC 2009, Special Detailed Requirements Based on Use and Occupancy:
A solid, liquid or gas associated with semiconductor manufacturing that has a degree-of-hazard rating in health, flammability or instability of Class 3 or 4 as ranked by NFPA 704 and which is used directly in research, laboratory or production processes which have as their end product materials that are not hazardous.
What must be verified before using this guidance?
Two of the I-Codes in this corpus define Hazardous Production Material (HPM), and the wording is not identical — read the version that governs your question.
| Code | Where it is defined | Definition |
|---|---|---|
| IBC 2009 | Special Detailed Requirements Based on Use and Occupancy | A solid, liquid or gas associated with semiconductor manufacturing that has a degree-of-hazard rating in health, flammability or instability of Class 3 or 4 as ranked by NFPA 704 and which is used directly in research, laboratory or production processes which have as their end product materials that are not hazardous. |
| IFC 2009 | Semiconductor Fabrication Facilities | A solid, liquid or gas associated with semiconductor manufacturing that has a degree-of-hazard rating in health, flammability or instability of Class 3 or 4 as ranked by NFPA 704 and which is used directly in research, laboratory or production processes which have, as their end product, materials that are not hazard0us. |
Where hazardous production material (hpm) is used in the code
The term appears in 4 chapters of the 2009 I-Codes hosted here. The chapters that lean on it hardest are the ones to read next.
| Chapter | Code | Mentions |
|---|---|---|
| Semiconductor Fabrication Facilities | IFC 2009 | 3 |
| Definitions | IBC 2009 | 1 |
| Special Detailed Requirements Based on Use and Occupancy | IBC 2009 | 1 |
| Definitions | IFC 2009 | 1 |
The terms hazardous production material (hpm) is built out of
The definition above leans on 2 other defined terms. Each carries its own code definition, and a local amendment to any of them changes what hazardous production material (hpm) covers:
- Liquid — IBC 2009: A material that has a melting point that is equal to or less than 68°F (20°C) and a boiling point that is greater than 68°F (20°C) at 14.7 pounds per square inch absolute (psia) (101 kPa).
- Solid — IBC 2009: A material that has a melting point, decomposes or sublimes at a temperature greater than 68°F (20°C).
Hazardous Production Material (HPM): what to open, and in what order
Every row is a document this term depends on. The ICC code library and the ICC adoption maps cover the middle rows.
| Check | Where | Confirmed |
|---|---|---|
| Read the definition in the adopted IBC | Special Detailed Requirements Based on Use and Occupancy | |
| Read the definition in the adopted IFC | Semiconductor Fabrication Facilities | |
| Re-check the requirement that uses it | Semiconductor Fabrication Facilities (IFC 2009) | |
| Re-check the requirement that uses it | Definitions (IBC 2009) | |
| Re-check the requirement that uses it | Special Detailed Requirements Based on Use and Occupancy (IBC 2009) | |
| Re-check the requirement that uses it | Definitions (IFC 2009) | |
| Confirm the dependent definition | Liquid | |
| Confirm the dependent definition | Solid | |
| Local amendment to any of the above | Jurisdiction's amendment list |
A research aid, not a code determination. The authority having jurisdiction decides which edition and which amendments apply.
Where can you explore related guidance?
Sources and method
Definitions quoted from the 2009 International Codes as transcribed in this site's building-codes collection, with the source chapter linked for each quotation. Usage counts are computed over the chapters hosted here, one copy per code. The ICC code library publishes the current model text and the ICC adoption maps show which edition a jurisdiction has adopted; those sources control.
Source links
Frequently asked questions
What is the code definition of hazardous production material (hpm)?
The International Building Code (IBC) 2009 defines it in Special Detailed Requirements Based on Use and Occupancy as: “A solid, liquid or gas associated with semiconductor manufacturing that has a degree-of-hazard rating in health, flammability or instability of Class 3 or 4 as ranked by NFPA 704 and which is used directly in research, laboratory or production processes which have as their end product materials that are not hazardous.” The 2009 model text is reproduced here; the definition that binds your project is the one in the edition your jurisdiction has adopted, as amended locally.
Which parts of the code depend on hazardous production material (hpm)?
In this corpus the term is used across 4 chapters, led by Semiconductor Fabrication Facilities in the IFC 2009. Those are the sections whose scope moves if the definition is amended locally, so read them together with Chapter 2 rather than on their own.
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